izindaba

1. Isidingo Esibalulekile Esivela Kumaseva E-AI Nezikhungo Zedatha

Amaseva e-AI amelela umthombo omkhulu wesidingo esikhulayo se-indwangu yefayibha yengilazi engenamandla aphansi. Izinqubo zokuqeqesha kanye nokuqonda nge-AI zithembele ekushintshaneni kwedatha okukhulu, okudinga ukusetshenziswa kwama-PCB anezinga eliphezulu kanye nobuchwepheshe bokuxhumana obusheshayo; lokhu kubeka izidingo ezinkulu ezimpahleni ze-dielectric kanye nokuzinza kobukhulu bezinto zokwakha. Ngokwamukelwa kobuchwepheshe obufana namamojula we-PCIe 6.0 kanye ne-224G optical, izidingo zokusebenza kwama-laminates e-copper-clad (CCL) kumaseva e-AI zishintshe kusukela ekulahlekelweni okujwayelekile okuphansi kuya ekulahlekelweni okuphansi kakhulu (ULL) kanye nokulahlekelwa okuphansi kakhulu (HLL), okuqhuba ngqo ukwanda kwesidingo samabanga afanele endwangu yefayibha yengilazi ephansi ye-dielectric. Idatha yemakethe ikhombisa ukuthi inani lama-CCL kumaseva e-AI liphindwe ka-5 kuya ku-8 kunelamaseva endabuko. Njengezinto zokusetshenziswa eziyinhloko, indwangu yefayibha yengilazi ephansi ye-dielectric ephezulu ibone intengo yayo ifinyelela ku-320,000–350,000 RMB/ton ngo-2025—ukwenyuka okungu-20% kusukela ekuqaleni konyaka—kanye namamodeli athile abhekene nokwenyuka kwamanani okufika ku-250%–300%.

Ngokuphathelene negebe lokuhlinzekwa kwezidingo, eliqhutshwa ukukhuphuka okuqhubekayo kwesidingo esivela kumakhasimende e-AI angaphansi kanye nemingcele ekukhiqizweni kwezindwangu zikagesi eziphezulu, amazinga esitoko sokuphepha kwezindwangu zikagesi eziphezulu kubakhiqizi abakhulu be-CCL ehle afinyelela ngaphansi kokuhlinzekwa kwesonto elilodwa, okubonisa ukwehla komlando. Ukuze kuhlangatshezwane nesidingo semikhiqizo ephezulu, abakhiqizi be-CCL baphoqelekile ukuphakamisa amanani okuthenga. Ngenxa yezitayela zamanje zamanani kanye nesimo sokufunwa kokunikezwa, izindwangu zefayibha yengilazi ephezulu zilungele ukubona ukwanda ngasikhathi sinye kokubili kumthamo kanye nentengo.

2. Izidingo Zokusebenza Zokupakisha Ama-Chip Asezingeni Eliphezulu

Ubuchwepheshe obuthuthukisiwe bokupakisha ama-chips e-AI bumelela esinye isimo esibalulekile sohlelo lokusebenza lwe-indwangu yefayibha yengilazi engenamandla aphansiNjengoba izinqubo zokukhiqiza ama-chip ziqhubekela phambili ku-node ye-3nm nangale kwalokho, ubuningi bokupakisha buyaqhubeka nokwenyuka. Ama-substrate e-ABF—abathwali ababalulekile abaxhuma ama-chip kuma-PCB—abeka izidingo eziqinile kakhulu ezimpahleni ze-dielectric kanye nobumsulwa bezinto zabo eziyisisekelo. Ngokuvamile, i-dielectric constant kumele iwele ngaphakathi kobubanzi be-3.0–4.0 (ku-1 MHz), kuye ngokuthi imvamisa yokusebenza isebenza kanjani, kuyilapho i-dissipation factor (Df) kumele ilawulwe phakathi kuka-0.005 no-0.010 (ku-1 MHz); izinhlelo zokusebenza zama-frequency aphezulu (njenge-5G kanye nokuxhumana kwesivinini esiphezulu) zingadinga amanani aphansi kakhulu (<0.005). Ngaphezu kwalokho, ukuze kuhlangatshezwane nezidingo zama-high density packaging, izinto kumele zilinganisele i-Coefficient of Thermal Expansion (CTE) ephansi enokumelana nokushisa okuphezulu ukuvimbela ukuphuka kwesekethe okubangelwa ukucindezeleka kokushisa. Indwangu ye-quartz fiber (eyaziwa nangokuthi “i-Q-fabric” noma “indwangu ye-elekthronikhi yesizukulwane sesithathu”) ivele njengento ekhethwayo ye-ABF substrates ngenxa ye-dielectric constant yayo ephansi (2.2–2.3), ukulahlekelwa kwe-dielectric okuncane (Df ka-0.001–0.0005), kanye nekhono lokubekezelela amazinga okushisa okusebenza isikhathi eside angu-600°C noma ngaphezulu.

Ukukhula okusheshayo kokuthunyelwa kwama-chip e-AI emhlabeni wonke kuqhubekisela phambili ukwanda kwesidingo sendwangu ye-quartz. Ngokusho kwezibikezelo ze-Future Think Tank, imakethe yendwangu ye-quartz yomhlaba wonke kulindeleke ukuthi ifinyelele ku-$3.127 billion ngo-2031, ngesilinganiso sokukhula sonyaka esihlanganisiwe (CAGR) esingu-23.30%. Lokhu kubikezela kugcizelela ukuthambekela okukhuphukayo kwesidingo, okuncike ekukhuleni okuqhubekayo kokuthunyelwa kwama-chip e-AI kanye nokwamukelwa kabanzi kobuchwepheshe bokupakisha obuthuthukisiwe. Ngaphezu kwalokho, ukuthuthukiswa kwamapulatifomu e-AI esizukulwane esilandelayo—njenge-“Rubin”—kuhambisana nezinqubo zokukhiqiza ama-chip e-3nm noma e-N4 futhi kusebenzisa ukupakishwa kwe-substrate enkulu kakhulu ye-CoWoS-L. Lawa mapulatifomu ahlanganisa ama-stack ayisishiyagalombili e-HBM4 ukuze ahlangabezane nezidingo ze-bandwidth ephezulu kanye nokuxhumana, enikeza ikhambi elifanele lokukhulisa amandla okusebenzisa ikhompyutha. Izidingo zama-substrate amakhulu kakhulu kanye nokusebenza ngokweqile kuzokwandisa isidingo sezinto zokusetshenziswa zendwangu ye-quartz, okuqhuba ukuvela kwezindwangu zengilazi ze-Low-Dk (ezihlala ziphansi ze-dielectric) ziye kuma-constant e-dielectric aphansi ngisho nasezicini zokulahlekelwa okuphansi.

3. Imiphumela Yokukhula Okuhlangene Kuzo Zonke Izigaba Eziningana

Ngale komkhakha oyinhloko wamandla okubalwa kwe-AI, isidingo esivela ezinkambeni ezifana nokuxhumana kwe-5G/6G kanye ne-electronics yabathengi ephezulu siqhuba ukukhula okuhambisanayo kanye ne-AI. Ukuvela kobuchwepheshe be-5G millimeter-wave (24-100 GHz) kuya kubuchwepheshe be-terahertz be-6G (ibanga lemvamisa cishe i-100 GHz-3 THz) kuhilela amaza aphezulu enza imishini yokuxhumana ibe bucayi kakhulu ekulahlekelweni kwesignali. Ngenkathi inkathi ye-5G idinga indwangu ye-fiberglass elahlekelwa kakhulu, inkathi ye-6G ibeka izidingo eziqinile kakhulu ze-dielectric constant (Dk) kanye ne-dissipation factor (Df): I-Dk kumele yehle iye ku-2.0-3.0 (ku->100 GHz), kanti i-Df kumele yehle isuka ku-5G standard engu-0.003-0.005 (ku-10 GHz) iye ku-0.0001-0.0007 (ku-100 GHz), okudala isidingo sendwangu ye-quartz "elahlekelwa kakhulu". Emkhakheni we-elekthronikhi yabathengi, i-iPhone 17 isebenzise indwangu ye-low-CTE (coefficient of thermal expansion) kanye nendwangu ye-dielectric ephansi ehlinzekwa yi-Honghe Technology ukubhekana nezinselele ezifana nokubopha i-chip ye-A10 Pro 3nm, ukuvimbela ukugoba kumabhodi e-motherboard aphezulu, kanye nokunciphisa ukulahleka kwamandla kumasignali e-5G/Wi-Fi 7 aphezulu. Lokhu kunyakaza kubonisa ukuguquka okusheshayo kwezindwangu ze-elekthronikhi eziphezulu kusukela kuzinhlelo zokusebenza zezimboni kuya kuma-elekthronikhi ajwayelekile abathengi, okuqhuba ukwanda kwesidingo sezinto ezibonakalayo kanye nokwandisa izikhathi zokuhola zokulethwa. Ukuthuthukiswa okuhlakaniphile kwe-elekthronikhi yezimoto nakho kunegalelo ekwandeni kwesidingo; ukushayela okuzimele okuthuthukisiwe (Izinga 3 nangaphezulu) kudinga izinzwa eziningi ze-ADAS kanye nama-radar aphezulu. Lezi zinhlelo zidinga ukuzinza kokudluliselwa kwesignali, ukuthembeka kwejoyinti le-solder lesikhathi eside, kanye nokuqina kwebanga lezimoto ngokumelene nokudlidliza, ukushisa, kanye nomswakama. Ngenxa yalokho, izinto zebhodi lesifunda ezinezingqimba eziphansi ze-dielectric, ukulahleka okuphansi kwe-dielectric, ukumelana kwe-CAF (conductive anodic filament), kanye ne-CTE ephansi kube yisinqumo esithandwayo sezinhlelo zokushayela ezihlakaniphile ezithuthukisiwe, okusheshisa kakhulu ukwamukelwa kabanzi kwendwangu ye-fiberglass ephezulu. Izibikezelo zemboni zisikisela ukuthi imakethe yomhlaba wonke yendwangu kagesi engashintshi kakhulu ingafinyelela kuma-yuan ayizigidi eziyizinkulungwane ezingu-3.76 ngo-2031, ikhule ngesilinganiso saminyaka yonke esingu-10.1%—umkhuba oqhutshwa kakhulu ukuhlangana kwesidingo emikhakheni eminingi.

Umngcele wokugcina wokwandisa amandla ekhompyutha usekudluleni emikhawulweni ebonakalayo yezinto zokwakha. Kusukela kuma-PCB alahlekelwa kakhulu asetshenziswa kumaseva e-AI kanye nendwangu ye-quartz ekupakisheni okuthuthukisiwe kuya kuma-laminate aphezulu e-electronics yabathengi kanye nokushayela okuzenzakalelayo, indwangu ye-fiberglass ene-dielectric ephansi ingena "esikhathini esingakaze sibonwe." Phakathi kwendawo yokufunwa kokunikezwa ebonakala ngokukhuphuka kwamanani, amanani akhuphukayo, kanye nokuntuleka kwamandla, le "ndwangu ye-elekthronikhi" ebonakala ilula ngokungangabazeki ivele njengenye yemikhakha ekhula kakhulu ehlanganisa ingqalasizinda yehadiwe ye-AI kanye nobuchwepheshe bokuxhumana obuphezulu besizukulwane esilandelayo.